RF 증폭기용 열전사 패드

설명

Best possible cooling for RF power transistors and PCB laminate in planar design pallets are critical for long life and best electrical performance for RF Power amplifiers. Again we are helping you by providing thermal transfer paste for transistors (put it between heatsink and transistors) and also special thermal transfer pads that go under planar design RF pallets. These get very hot during operation so leaving that cavity open is not optimal solution. 

We have chosen the thermal transfer pads material so that it gives best possible thermal conductivity while not interfering with RF circuitry.

주요 특징들:
– Optimized thermal performance
– RF 전력 트랜지스터의 수명 연장
– 향상된 P1dB 성능
– 향상된 IMD3 성능

Thermal pad size:
– 100mm 100mm x 5mm