用於射頻放大器的熱轉印墊

描述

Best possible cooling for RF power transistors and PCB laminate in planar design pallets are critical for long life and best electrical performance for RF Power amplifiers. Again we are helping you by providing thermal transfer paste for transistors (put it between heatsink and transistors) and also special thermal transfer pads that go under planar design RF pallets. These get very hot during operation so leaving that cavity open is not optimal solution. 

We have chosen the thermal transfer pads material so that it gives best possible thermal conductivity while not interfering with RF circuitry.

主要特徵：
– Optimized thermal performance
– 射頻功率晶體管的壽命更長
– 改進的 P1dB 性能
– 改進的 IMD3 性能

Thermal pad size:
– 100mm 100mm x 5mm