Best possible cooling for RF power transistors and PCB laminate in planar design pallets are critical for long life and best electrical performance for RF Power amplifiers. Again we are helping you by providing thermal transfer paste for transistors (put it between heatsink and transistors) and also special thermal transfer pads that go under planar design RF pallets. These get very hot during operation so leaving that cavity open is not optimal solution.
We have chosen the thermal transfer pads material so that it gives best possible thermal conductivity while not interfering with RF circuitry.
– Optimized thermal performance
– Longer life of RF power transistors
– Improved P1dB performance
– Improved IMD3 performance
Thermal pad size:
– 100mm 100mm x 5mm